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| Service Type | Description | Lead Time | Supported Materials | Quality Assurance |
|---|---|---|---|---|
| Wafer Fabrication | Complete fabrication services for silicon wafers. | 4-6 weeks | Silicon, SOI, GaAs | ISO 9001 |
| Wafer Dicing | Precision cutting of wafers into desired sizes. | 1-2 weeks | Silicon, Sapphire | In-house testing |
| Wafer Bonding | Advanced wafer bonding techniques for 3D integration. | 2-4 weeks | Si-Si, Si-GaAs | Continuous monitoring |
| Wafer Packaging | Comprehensive packaging solutions for semiconductor devices. | 1-3 weeks | Standard and custom solutions | Full traceability |
| Wafer Testing | Electrical and functional testing services for wafers. | 2 weeks | Various semiconductor materials | Automated processes |